Scientists have developed a new technology inspired by Superman’s X-ray vision that allows users to see through solid objects like walls and packages. This groundbreaking technology uses an imager microchip small enough to fit into a smartphone, emitting radiation in the terahertz range to create images.
The imager chip, first demonstrated in 2022 after 15 years of research, uses signals at 200 gigahertz to 400 gigahertz to create images that are invisible to the human eye. Unlike X-rays, which can be harmful, terahertz waves are considered safe and can penetrate obstacles like fog and dust. The chip does not rely on external lenses for image clarity but instead uses CMOS technology to create high-resolution images.
The latest model of the imager chip features a 1 x 3 array of 296-GHz CMOS pixels, making it small enough to fit into a handheld device like a smartphone. The pixels detect signals reflected from objects to create images, with the chip capable of imaging objects from a close distance of about one centimeter away. The researchers plan to improve the technology to capture images from up to five inches away in the next iteration.
The technology has a wide range of potential applications, from finding studs behind walls to identifying cracks in pipes and even medical uses. The research was supported by the Texas Instruments Foundational Technology Research Program and the Samsung Global Research Outreach Program.
With continuous advancements in terahertz imaging technology, the possibilities for this new technology are endless. The ability to see through solid objects like walls and packages could revolutionize various industries and provide new opportunities for innovation and discovery. As researchers continue to improve the technology, we can expect even more exciting developments in the field of terahertz imaging in the near future.