AMD is introducing a new generation of desktop processors, the Ryzen 9000X3D, with stacked cache known as 3D-V Cache. This new cache die is expected to bring technical improvements compared to its predecessor, the Ryzen 7000X3D.
In a recent interview with US media, AMD’s Senior Technical Marketing Manager, Donny Woligroski, hinted at exciting new features for the Ryzen 9000X3D. While he did not provide specific details, there is speculation about potential improvements such as an increase in the amount of cache. Previous models like the Ryzen 5000X3D and Ryzen 7000X3D had an additional 64 MB of cache, which helped improve performance in latency-sensitive tasks and gaming.
One area where AMD could make enhancements is in cooling, possibly by optimizing the design of the dies. The 3D-V Cache is integrated directly onto the compute chiplets, which can pose challenges for cooling. To address this, AMD may adjust clock frequencies and voltages for better thermal performance. For example, the Ryzen 7 7800X3D has a maximum clock speed of 5.0 GHz, while the Ryzen 7 7700X can reach 5.4 GHz.
Rumors suggest that the Ryzen 9000X3D will be released two months after the standard Ryzen 9000, possibly in September 2024. The flagship eight-core Ryzen 7 9800X3D is expected to be a powerhouse for gaming PCs, offering superior performance. While the standard Ryzen 9000 may not significantly outperform the Ryzen 7000X3D in gaming, AMD claims that the difference between the two CPU series is minimal.
Overall, the Ryzen 9000X3D series is poised to deliver improved performance and features for gamers and PC enthusiasts. Stay tuned for more updates on this exciting new release from AMD.